According to recently released annual statistical data from China’s National Intellectual Property Administration (CNIPA), there were 1,828,054 invention patent applications filed in 2024; 3,184,652 utility model applications filed in 2024; and 819,213 industrial design applications filed in 2024. The number of invention patent applications and grants have both climbed annually at a regular pace but grants faced a steep drop in the first half of 2025. Annual utility model applications have grown regularly also, except for a small drop in 2021 perhaps due to COVID. However, annual utility model grants have dropped regularly since a peak in 2021 at 3,119,990 grant to a low in 2024 of 2,009,657. Utility model grants have continued to drop in the first half of 2025.The drop in utility model grants despite the increase in utility model applications may be caused by the continuing crackdown on “abnormal” patent applications and the introduction of an inventiveness examination for utility models.

With respect to foreign origin of Chinese patent grants, Japan was the most prolific foreign source of invention patents in 2024 with 31,772 grants, down from 32,929 grants in 2023. The United States was next with 28,468 grants, up from 24,005 grants. The list of the top 10 sources of foreign invention patents by country follows. Note that number 10 – Cayman Islands – is presumably due to Internet-related Chinese-origin Variable Interest Entities (VIEs) that incorporate overseas to accept foreign investment, e.g., Alibaba and JD.com.

In terms of Chinese-originated foreign filings for invention patent application in 2023, the US was the largest destination with 49,740 Chinese-origin patent applications. The EPO was next with 20,762 Chinese-origin patent applications. A table of the top 10 destinations follow. South Africa may a top destination due to the low cost of filing and prosecution combined with high subsidies available for foreign patent grants (which sunset in 2025).

The full data is available, including for geographical indications, trademarks and integrated circuit layouts is available here (Chinese and English).